- In a significant initiative aimed at empowering India's semiconductor industry, the Government of Odisha has entered into an agreement with Intel and 3D Glass Solutions.
- Under this agreement, finalized on May 28–29, 2026, state-of-the-art glass substrate technology will be developed within India. This project is set to be established in the Info Valley region of Bhubaneswar, thereby providing a new boost to the country's semiconductor manufacturing infrastructure.
- Semiconductor packaging is a critical process involving the protection of electronic chips and rendering them suitable for use in various devices.
- Through advanced packaging technologies, the capacity, speed, and performance of electronic products are significantly enhanced.
- 3D glass-based packaging technology is regarded as the next-generation technology in this sector.
- This project received approval in August 2025 under the India Semiconductor Mission.
- It will be operated by the US-based company, 3D Glass Solutions, through its Indian subsidiary, Heterogeneous Integration Packaging Solutions Private Limited.
- This initiative is viewed as a pivotal step toward securing a strong presence for India in the global semiconductor supply chain and fostering self-reliance in the field of high-tech manufacturing.
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